Gigabyte B850M Aorus Elite WIFI6E Motherboard
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About this product
- Brand
- Gigabyte
- Store
- PC Case Gear
- Category
- Electronics > Circuit Boards & Components > Printed Circuit Boards > Computer Circuit Boards > Motherboards
- SKU
- B850M-AORUS-ELITE-WIFI6E-REV-1X
The Gigabyte B850M AORUS ELITE WIFI6E features the AMD B850 chipset with Socket AM5 support for AMD Ryzen 9000, 8000 and 7000 series desktop processors and a robust 12 + 2 + 2 digital VRM to keep CPUs stable under load. It has 4 DDR5 DIMM slots supporting dual-channel memory up to around 8200 MT/s (OC) with AMD EXPO and XMP profiles plus two M.2 slots including a PCIe 5.0 x4 for next-gen NVMe SSDs and a PCIe 5.0 x16 slot for GPUs. Integrated Wi-Fi 6E with ultra-high gain antenna, 2.5 Gb Ethernet, multiple USB 3.2 Gen2/Gen1 and USB-C ports plus HDMI and DisplayPort cover modern connectivity. Built-in thermal armour, Smart Fan 6 headers, Q-Flash Plus and RGB/ARGB headers make it friendly for performance builds and DIY cooling setups.
Warning: This product contains a button battery
If swallowed, a lithium battery can cause severe or fatal injuries with 2 hours.
Keep batteries out of reach of children.
If you think batteries may have been swallowed or placed inside any of the body, seek immediate medical attention.
Features
B850M AORUS ELITE WIFI6E (Rev. 1.x)
- X3D Turbo Mode : Unleash new era gaming performance
- DDR5 OC up to 8200MT/s
- AMD Socket AM5 : Supports AMD Ryzen™ 9000 / 8000 / 7000 Series Processors
- Digital twin 12+2+2 phases VRM solution
- Dual Channel DDR5 : 4*DIMMs with AMD EXPO™Memory Module Support
- WIFI EZ-Plug : Quick and easy design for Wi-Fi antenna installation
- EZ-Latch Plus : PCIe and M.2 slots with Quick Release & Screwless Design
- EZ-Latch Click : M.2 heatsinks with screwless design
- Sensor Panel Link : Onboard video port for hassle-free in-chassis panel setup
- Friendly UI : Multi-Theme, AIO Fan Control, and Q-Flash Auto Scan in BIOS and SW.
- Ultra-Fast Storage : 2*M.2 slots, including PCIe 5.0 x4
- Efficient Thermal : VRM Thermal Armour Advanced & M.2 Thermal Guard Ext.
- Fast Networking : 2.5GbE LAN & Wi-Fi 6E with directional Ultra-high gain antenna
- Extended Connectivity : HDMI, DisplayPort
- PCIe UD Slot : PCIe 5.0 x16 slots with 10X strength for graphics card & Better Heat dissipation effect
Brand New Gaming Experience
X3D Turbo Mode
Unleash New Era Gaming Performance with One-Click Activation.
X3D Turbo Mode's unique optimisation parameters allow even Ryzen™ 9000 X3D gaming Performance enhance & Ryzen™ 9000 non-X3D processors to achieve similar gaming performance levels as their Ryzen™ X3D counterparts. Experience smoother gameplay, higher frame rates, and reduced latency with GIGABYTE's BIOS innovation- X3D Turbo Mode.
One-Click Acceleration
Enhance Gaming FPS Performance with a single click.
- Enhance Up to 18% (Differences in performance enhancement depending on the game.)
D5 Bionic Corsa
Advanced AI-enhanced overclocking tech. for DDR5.
AI Overclocking for Peak Performance
Aorus AI Snatch
Unleash Ultimate Performance with One-Click Activation.
- Fast AI Performance
- Enhanced Computing Power
- EZ to Peak
- Safe OC
- Less Power Usage
Auto CPU & DDR5 Memory Boost
With just a single click, unleash the full potential of CPU & DDR5 memory, instantly boosting your gaming and work efficiency.
One-Click Acceleration
Enhance CPU & DDR5 speeds with a single click.
- Real time Analysis
- OC accuracy UP
- EZ to Pro
Fast AI Performance
Accelerate AI processing for greater performance.
- Up to 8% AI Performance (GeekBench AI PRO test conducted with High Bandwidth option manually enabled.)
- Accelerated AI decision-making
- Boosted reinforcement learning
- Streamlined language processing
Boost CPU & Memory Performance
Raise system speed and performance. (Tested by AIDA64 Memory) (Tested by R23 Multi Core)
- Up to 9% Memory Performance Boost
- Tailored-overclocking for your CPU and memory
- Faster data transfer and application loading
- Improved multitasking performance
- Optimised overall system performance
Maximise Performance in a Snap
Enable users to easily become overclocking experts through a simple interface.
- EZ to Peak
Smart & Safe Overclocking
Protect your motherboard through multiple over-temperature and over-current safeguards.
- OTP - Over Temperature Protection
- OCP - Over Current Protection
- OVP - Over Voltage Protection
- OPP - Over Power Protection
- UVP - Under Voltage Protection
- SCP - Short Circuit Protection
Less Power Usage Optimal Power-Efficiency
- Enhance Up to 9% CP/Per Watt
With faster computations, it also means reduced power consumption, making it more environmentally friendly and energy-efficient, continuously contributing to the well-being of our planet.
AIDA64 Extreme 7 test conducted with High Bandwidth option manually enabled.
AI Design for MB Signal Enhancement
AI-Driven PCB Technology - Redefining PCB Design with Artificial Intelligence
AI-Driven PCB Technology employs AI algorithms to optimise vias, routing and stackups. It ensures peak performance and signal integrity across single and cross-layer throughout the design process.
AI-ViaFusion Technology
Optimised vias & pads for signal integrity.
AI-Trace Technology
Smart routing for peak performance.
AI-Layer Technology
- Tailored stackups for enhanced functionality.
Key Features
- AI-Generated Design Recipes
- AI-Driven Simulation
- AI-Powered Signal Verification
- Single and cross-layer signal optimisation
AI-ViaFusion™ Technology - AI-Powered Excellence in Signal Integrity
- Reduction in Signal Reflection Up to 28.2%
AI-ViaFusion, an AI-assisted via optimisation technology, determines optimal via and pad sizes across PCB areas. This technology enhances cross-layer signal integrity and transmission efficiency, outperforming traditional design methods.
Best-in-Class Signal Quality
- Superior signal transmission efficiency
- Dramatically reduced signal reflection
- Elevated signal quality and reliability
- Enhanced cross-layer PCB signal performance
AI-ViaFusion Technology - AI-Engineered Via Design Formula
AI-ViaFusion is a proprietary AI-generated hybrid via structure design. This PCB technology, validated through AI simulations and testing, aims to enhance high-speed signal transmission.
Optimised Via Design
Varied via sizes for optimised signal and power paths
Driven Pad Optimisation
Custom pad sizes for performance and p
