Gigabyte X870E Aorus Elite X3D Motherboard

The X870E AORUS ELITE X3D motherboard features the AMD X870E chipset with Socket AM5 support for Ryzen 9000, 8000 and 7000 series processors and four DDR5 DIMM slots with AMD EXPO memory profiles and DDR5-9000 MT/s overclocking support. It includes GIGABYTE's AI-enhanced X3D Turbo Mode 2.0 for one-click performance optimisation, a robust digital 16 + 2 + 2 VRM design and four M.2 slots with PCIe 5.0 support for ultra-fast storage. Networking and connectivity include Wi-Fi 7 with high-gain antennas, 5 GbE LAN, dual USB4 Type-C with DisplayPort-Alt, HDMI, SATA and multiple USB ports for modern peripherals. The board also offers thermal solutions, M.2 EZ-Latch features and DIY-friendly design for easy builds.

Warning: This product contains a button battery
- If swallowed, a lithium battery can cause severe or fatal injuries with 2 hours.
- Keep batteries out of reach of children.
- If you think batteries may have been swallowed or placed inside any of the body, seek immediate medical attention.

Features

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X870E Aorus Elite X3D

• X3D Turbo Mode 2.0 : Incredible X3D performance unleashed by AI
• DDR5 OC up to 9000MT/s
• DriverBIOS : Wi-Fi Driver Pre-install, Power-On & EZ to Launch the Network.
• AMD Socket AM5 : Supports AMD Ryzen™ 9000 / 8000 / 7000 Series Processors
• Digital twin 16+2+2 phases VRM solution
• Dual Channel DDR5 : 4*DIMMs with AMD EXPO™Memory Module Support
• M.2 EZ-Flex : high-efficiency heat dissipation & flexible patented baseplate for M.2 SSD
• WIFI EZ-Plug : Quick and easy design for Wi-Fi antenna installation
• M.2 EZ-Latch Click & Plus : Quick Release & Screwless Design on M.2 slots and heatsinks
• Friendly UI : Multi-Theme, AIO Fan Control, and Q-Flash Auto Scan in BIOS and SW
• Ultra-Fast Storage : 4*M.2 slots, including PCIe 5.0 x4
• PCB Thermal Plate : 14% thermal improvement and reinforced motherboard stability.
• Efficient Thermal : VRM Thermal Armour Advanced & M.2 Thermal Guard L & M.2 Thermal Guard Ext.
• Fast Networking : 5GbE LAN & Wi-Fi 7 with directional Ultra-high gain antenna
• Extended Connectivity : HDMI, Dual USB4 Type-C with DP-Alt, Front QC-USB 65W
• PCIe UD Slot X : PCIe 5.0 x16 slot with 10X strength for graphics card

Brand New Gaming Experience

X3D Turbo Mode 2.0

Incredible X3D Performance Unleashed by AI

Unleash New Era Gaming Performance with One-Click Activation.

X3D Turbo Mode 2.0 delivers enhanced gaming and multitasking performance over the first generation. Built-in AI model and hardware circuits dynamically optimise X3D processor parameters in real-time, significantly boosting Ryzen™ X3D performance.

Through GIGABYTE's innovative X3D Turbo Mode 2.0 technology, users can enjoy a smoother gaming experience.

One-Click Acceleration

Faster, fiercer, more precise with a single click.

• Enhance Up to 25% (Differences in performance enhancement depending on the game.)

True AI Overclocking Revolution

Specialised Hardware Processing

Dedicated hardware block for real-time performance tuning.

Dynamic OC Engine Model

Trained on vast X3D processor datasets.

X3D Turbo Mode 2.0 offers two distinct modes — Extreme Gaming Mode & Max Performance Mode — allowing users to freely switch between them based on their usage scenario to achieve optimal performance.

D5 Bionic Corsa

Advanced AI-enhanced overclocking tech for DDR5.

AI Overclocking for Peak Performance

Aorus AI Snatch

Unleash Ultimate Performance with One-Click Activation.

Auto CPU & DDR5 Memory Boost

With just a single click, unleash the full potential of CPU & DDR5 memory, instantly boosting your gaming and work efficiency.

• Fast AI Performance
• Enhanced Computing Power
• EZ to Peak
• Safe OC
• Less Power Usage

One-Click Acceleration

Enhance CPU & DDR5 speeds with a single click.

• Real time Analysis
• OC accuracy UP
• EZ to Pro

Fast AI Performance

Accelerate AI processing for greater performance.

• Up to 8% AI Performance (GeekBench AI PRO test conducted with High Bandwidth option manually enabled.)
• Accelerated AI decision-making
• Boosted reinforcement learning
• Streamlined language processing

Boost CPU & Memory Performance

Raise system speed and performance. (Tested by AIDA64 Memory) (Tested by R23 Multi Core)

• Up to 9% Memory Performance Boost
• Tailored-overclocking for your CPU and memory
• Faster data transfer and application loading
• Improved multitasking performance
• Optimised overall system performance

Maximise Performance in a Snap

Enable users to easily become overclocking experts through a simple interface.

• EZ to Peak

Smart & Safe Overclocking

Protect your motherboard through multiple over-temperature and over-current safeguards.

• OTP - Over Temperature Protection
• OCP - Over Current Protection
• OVP - Over Voltage Protection
• OPP - Over Power Protection
• UVP - Under Voltage Protection
• SCP - Short Circuit Protection

Less Power Usage Optimal Power-Efficiency

• Enhance Up to 9% CP/Per Watt

With faster computations, it also means reduced power consumption, making it more environmentally friendly and energy-efficient, continuously contributing to the well-being of our planet.

AIDA64 Extreme 7 test conducted with High Bandwidth option manually enabled.

AI Design for MB Signal Enhancement

AI-Driven PCB Design

Redefining PCB Design with AI.

AI-Driven PCB Technology - Redefining PCB Design with Artificial Intelligence

AI-Driven PCB Technology employs AI algorithms to optimise vias, routing and stackups. It ensures peak performance and signal integrity across single and cross-layer throughout the design process.

AI-ViaFusion Technology

Optimised vias & pads for signal integrity.

AI-Trace Technology

Smart routing for peak performance.

AI-Layer Technology

• Tailored stackups for enhanced functionality.

Key Features

• AI-Generated Design Recipes
• AI-Driven Simulation
• AI-Powered Signal Verification
• Single and cross-layer signal optimisation

AI-ViaFusion™ Technology - AI-Powered Excellence in Signal Integrity

• Reduction in Signal Reflection Up to 28.2%

AI-ViaFusion, an AI-assisted via optimisation technology, determines optimal via and pad sizes across PCB areas. This technology enhances cross-layer signal integrity and transmission efficienc