Gigabyte X870E Aorus Master X3D Ice Motherboard
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About this product
- Brand
- Gigabyte
- Store
- PC Case Gear
- Category
- Electronics > Circuit Boards & Components > Printed Circuit Boards > Computer Circuit Boards > Motherboards
- SKU
- X870E-AORUS-MASTER-X3D-ICE
The Gigabyte X870E Aorus Master X3D Ice Motherboard features an AMD AM5 socket, DDR5 memory support up to 9000 MT/s, 18+2+2 phase VRM, PCIe 5.0 slots and USB4 Type-C connectivity. It also includes advanced thermal design, multiple M.2 slots with heatsinks, AI-driven X3D Turbo Mode and a robust 8-layer PCB for stable high-end gaming performance.
Warning: This product contains a button battery
- If swallowed, a lithium battery can cause severe or fatal injuries with 2 hours.
- Keep batteries out of reach of children.
- If you think batteries may have been swallowed or placed inside any of the body, seek immediate medical attention.
Features
Brand New Gaming Experience
X3D Turbo Mode 2.0
Incredible X3D Performance Unleashed by AI
Unleash New Era Gaming Performance with One-Click Activation.
X3D Turbo Mode 2.0 delivers enhanced gaming and multitasking performance over the first generation. Built-in AI model and hardware circuits dynamically optimise X3D processor parameters in real-time, significantly boosting Ryzen™ X3D performance.
Through GIGABYTE's innovative X3D Turbo Mode 2.0 technology, users can enjoy a smoother gaming experience.
One-Click Acceleration
Faster, fiercer, more precise with a single click.
- Enhance Up to 25% (Differences in performance enhancement depending on the game.)
True AI Overclocking Revolution
Specialised Hardware Processing
Dedicated hardware block for real-time performance tuning.
Dynamic OC Engine Model
Trained on vast X3D processor datasets.
X3D Turbo Mode 2.0 offers two distinct modes — Extreme Gaming Mode & Max Performance Mode — allowing users to freely switch between them based on their usage scenario to achieve optimal performance.
D5 Bionic Corsa
Advanced AI-enhanced overclocking tech for DDR5.
AI Overclocking for Peak Performance
Aorus AI Snatch
Unleash Ultimate Performance with One-Click Activation.
Auto CPU & DDR5 Memory Boost
With just a single click, unleash the full potential of CPU & DDR5 memory, instantly boosting your gaming and work efficiency.
- Fast AI Performance
- Enhanced Computing Power
- EZ to Peak
- Safe OC
- Less Power Usage
One-Click Acceleration
Enhance CPU & DDR5 speeds with a single click.
- Real time Analysis
- OC accuracy UP
- EZ to Pro
Fast AI Performance
Accelerate AI processing for greater performance.
- Up to 8% AI Performance (GeekBench AI PRO test conducted with High Bandwidth option manually enabled.)
- Accelerated AI decision-making
- Boosted reinforcement learning
- Streamlined language processing
Boost CPU & Memory Performance
Raise system speed and performance. (Tested by AIDA64 Memory) (Tested by R23 Multi Core)
- Up to 9% Memory Performance Boost
- Tailored-overclocking for your CPU and memory
- Faster data transfer and application loading
- Improved multitasking performance
- Optimised overall system performance
Maximise Performance in a Snap
Enable users to easily become overclocking experts through a simple interface.
- EZ to Peak
Smart & Safe Overclocking
Protect your motherboard through multiple over-temperature and over-current safeguards.
- OTP - Over Temperature Protection
- OCP - Over Current Protection
- OVP - Over Voltage Protection
- OPP - Over Power Protection
- UVP - Under Voltage Protection
- SCP - Short Circuit Protection
Less Power Usage Optimal Power-Efficiency
- Enhance Up to 9% CP/Per Watt
With faster computations, it also means reduced power consumption, making it more environmentally friendly and energy-efficient, continuously contributing to the well-being of the planet.
AIDA64 Extreme 7 test conducted with High Bandwidth option manually enabled.
AI Design for MB Signal Enhancement
AI-Driven PCB Design
Redefining PCB Design with AI.
AI-Driven PCB Technology - Redefining PCB Design with Artificial Intelligence
AI-Driven PCB Technology employs AI algorithms to optimise vias, routing and stackups. It ensures peak performance and signal integrity across single and cross-layer throughout the design process.
AI-ViaFusion Technology
Optimised vias & pads for signal integrity.
AI-Trace Technology
Smart routing for peak performance.
AI-Layer Technology
- Tailored stackups for enhanced functionality.
Key Features
- AI-Generated Design Recipes
- AI-Driven Simulation
- AI-Powered Signal Verification
- Single and cross-layer signal optimisation
AI-ViaFusion™ Technology - AI-Powered Excellence in Signal Integrity
- Reduction in Signal Reflection Up to 28.2%
AI-ViaFusion, an AI-assisted via optimisation technology, determines optimal via and pad sizes across PCB areas. This technology enhances cross-layer signal integrity and transmission efficiency, outperforming traditional design methods.
Best-in-Class Signal Quality
- Superior signal transmission efficiency
- Dramatically reduced signal reflection
- Elevated signal quality and reliability
- Enhanced cross-layer PCB signal performance
AI-ViaFusion Technology - AI-Engineered Via Design Formula
AI-ViaFusion is a proprietary AI-generated hybrid via structure design. This PCB technology, validated through AI simulations and testing, aims to enhance high-speed signal transmission.
Optimised Via Design
Varied via sizes for optimised signal and power paths
Driven Pad Optimisation
Custom pad sizes for performance and production balance
Precision Impedance Matching
Via & pad sizes selected for optimal signal impedance
Unlock AI-Powered Performance with AI-ViaFusion Technology
Minimised Insertion Loss
Optimised vias reduce signal loss
Enhanced Return Loss
Precision impedance matching reduces reflections
Optimised Eye Diagram
Wider eye opening improves signal integrity (Eye Diagram: Signal quality assessment tool in digital communications. Overlays bit cycle waveforms, forming eye-like pattern. Larger, clearer opening indicates better signal quality and transmission reliability.)
AI-ViaFusion Technology - AI-Driven Revolution in PCB Design
Vias (Vertical Interconnect Access) are critical for multi-layer PCB connectivity. Via size significantly impacts signal integrity, affecting ca
