Thermaltake TG-30 Heat Sink Compound Thermal paste 4.5 With m K

Thermaltake TG-30 Heat Sink Compound Thermal paste 4.5 With m K

Price$15

In stock at JW Computers

Price checked today

Buy at JW Computers

We may earn a commission if you buy; it doesn't change your price. Check the price at JW Computers before you buy. How we make money

Price history

Tracking since today

The price hasn't changed since we started tracking it. We'll show its history once it does.

About this product

Category
Electronics > Electronics Accessories > Computer Components > Computer System Cooling Parts > Thermal Compounds & Pads
SKU
454751

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

High Thermal Conductivity
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user s primary needs.

Easy to Apply
Thermaltake s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.

All-In-One Application Kit
This thermal compound application kit includes a set of easily-applied tools for immediate use.

Sustainability and Safety
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.